L3 Technologies is making changes to its uncooled amorphous silicon (a-SI) microbolometer business. The company’s L3 Sensor Technologies (formerly L3 Infrared Products in Garland, Texas) is moving its front-end production of FPAs to TSI Semiconductors (Roseville, California), while vacuum Wafer-Level-Packaging (WLP) is being moved to Mason, Ohio. By the end of the year, the Garland facility is expected to be shut down, with only design engineering remaining in the Dallas, Texas area.
Competing with Uncooled
The First Step to Wider Infrared Use in Commercial Aviation?
A Trend in Seeker Technology?
Solving the “Safety Scan” Problem
SDD Contract Sets the Stage for Production of 3rd Gen FLIR Engines
The size of infrared focal plane arrays (FPA) is poised for a large increase. Currently, both InSb and MWIR MCT arrays have been fabricated in a 2K x 2K monolithic configuration, with the InSb FPA used in the SHARP reconnaissance pod and the MCT FPA used in the NIRCam instrument on the James Webb Space Telescope (JWST).
CMC Electronics has shipped its 100th EVS (Enhanced Vision System) for aircraft. Most of these are the SureSight® I-Series.
Kollsman is preparing to roll out its uncooled enhanced vision system for general aviation aircraft, GAViS™ (General Aviation Vision System).